HIGH TEMPERATURE HEATING DEVICE

PROBLEM TO BE SOLVED: To provide a high temperature heating device capable of carrying out heat treatment in a high temperature of an heat treatment target object such as a wafer substrate placed in a reaction chamber. SOLUTION: In the high temperature heating device having a heating part 11 formed with the reaction chamber 13 of an airtight state carrying out the heat treatment in the high temperature of the heat treatment target object placed on a substrate pedestal 33, a cooling part 31 which can be made airtight is provided in a heat treatment target object inserting side of the heating part 11, a shutter 52 for airtightness and a shutter 53 for heat insulating separating the cooling part 31 and the heating part 11 in airtight states are provided between the cooling part 31 and the heating part 11, both shutters 52 and 53 are opened to move the substrate pedestal 33 into the reaction chamber when carrying out heat treatment of the heat treatment target object in the reaction chamber 13, the heat treatment target object is moved from the reaction chamber 13 to the cooling part 31 and both shutters 52 and 53 are closed after the heat treatment, the heat treatment target object is cooled in the cooling part 31, and a temperature of the reaction chamber of the heating part is maintained at a certain high temperature. COPYRIGHT: (C)2006,JPO&NCIPI