ELECTRIC INSULATION STRUCTURE FOR FORMING ELECTRIC INSULATION LAYER TO BE USED FOR CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide an electric insulation structure for forming an electric insulation layer which can be used for a circuit board such as a PCB, a chip carrier, or the like. SOLUTION: The electric insulation layer contains a hardened resin material and a filler in the shape of particl...

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Bibliographische Detailangaben
Hauptverfasser:	PAPATHOMAS KOSTAS, JAPP ROBERT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electric insulation structure for forming an electric insulation layer which can be used for a circuit board such as a PCB, a chip carrier, or the like. SOLUTION: The electric insulation layer contains a hardened resin material and a filler in the shape of particles of a specified wt.%, and does not contain continuous fiber, semi-continuous fiber, or the like. COPYRIGHT: (C)2006,JPO&NCIPI