FORMING METHOD OF DIE PROTECTION LAYER

FORMING METHOD OF DIE PROTECTION LAYER

PROBLEM TO BE SOLVED: To provide a forming method of die protecting layer for lowering manufacturing cost, enhancing manufacturing yield of product, and also enhancing convenience in the successive package process. SOLUTION: The forming method of die protection layer comprises basic processes of sup...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WU MEI-HUI, GO HAKUJIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a forming method of die protecting layer for lowering manufacturing cost, enhancing manufacturing yield of product, and also enhancing convenience in the successive package process. SOLUTION: The forming method of die protection layer comprises basic processes of supplying a wafer provided with a plurality of dies at the first surface of the second surface of the wafer, and forming a transparent protection layer to the first surface or the second surface provided with die. The transparent protection layer is formed in direct to the die in the wafer. COPYRIGHT: (C)2006,JPO&NCIPI