SUBSTRATE DEVICE

PROBLEM TO BE SOLVED: To certainly perform the removal of a substrate in a substrate device which is constituted by the story building of a plurality of substrates, such as a two-story building. SOLUTION: A spacer 9 is interposed between a first printed circuit substrate 5 and a second printed circu...

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1. Verfasser: TSUBOUCHI TOSHIMICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To certainly perform the removal of a substrate in a substrate device which is constituted by the story building of a plurality of substrates, such as a two-story building. SOLUTION: A spacer 9 is interposed between a first printed circuit substrate 5 and a second printed circuit substrate 7. A threaded hole 19 is provided in the threaded hole surface 17 of the spacer 9, and the second printed circuit substrate 7 is clamped with the threaded hole surface 17 by a screw 21. A peripheral stop for limiting the rotation of the spacer 9 to the second printed circuit substrate 7 is provided on the threaded hole surface 17. The peripheral stop is, for example, a minus groove 23. The surface member of the second printed substrate 7 is intruded into the minus groove 23, and the rotation of the spacer 9 to the second printed circuit substrate 7 is prevented. Thus, when the screw 21 is loosened, the spacer 9 is not rotated together with the screw 21, and hence only the screw 21 can be certainly removed. COPYRIGHT: (C)2006,JPO&NCIPI