WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board which can be manufactured through more efficient and economical processes as compared with conventional technology. SOLUTION: The wiring board can be quickly manufactured without requiring excess materials and operation by starting etching from the sam...

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1. Verfasser: TSURUGASAKI MASATO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring board which can be manufactured through more efficient and economical processes as compared with conventional technology. SOLUTION: The wiring board can be quickly manufactured without requiring excess materials and operation by starting etching from the same positions on both the sides of a metal plate 1, forming a metallic pattern by dividing a prescribed area including the metal exists from an area not including the metal, and then filling the area not including the metal with insulating resin 2 from the backside of the metallic plate. Specifically, the board is manufactured through a process (1) for simultaneously performing etching from the backside and etching from the surface side in etching for both the sides, and then filling the area not including the metal with the insulating resin; or a process (2) for performing etching of the backside at first, filling the metal plate dented by the etching with the insulating resin, and then etching the surface side. COPYRIGHT: (C)2006,JPO&NCIPI