PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a printed wiring board which reconciles both a thin-line and high-density conductor pattern and connection reliability, and to provide its manufacturing method. SOLUTION: Thin steps 21 are formed at peripheral edges of through holes of conductor patterns 2 formed on...

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Hauptverfasser:	SUGIYAMA TEI, IMAMURA EIJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	SUGIYAMA TEI IMAMURA EIJI
description	PROBLEM TO BE SOLVED: To provide a printed wiring board which reconciles both a thin-line and high-density conductor pattern and connection reliability, and to provide its manufacturing method. SOLUTION: Thin steps 21 are formed at peripheral edges of through holes of conductor patterns 2 formed on both top and reverse surfaces 1A and 1B of an insulating substrate. On the thin steps 21, surface-directional plating parts 42 are laminated on the thin steps 21 to protrude from both ends of penetration-directional plating parts 41 deposited on the inner wall of the through hole 3 along the insulating substrate 1. Consequently, the conductor patterns 2 and the plated through holes 3 are interconnected having contact surfaces extending along the conductor patterns 2 and in a direction crossing it. COPYRIGHT: (C)2006,JPO&NCIPI
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SOLUTION: Thin steps 21 are formed at peripheral edges of through holes of conductor patterns 2 formed on both top and reverse surfaces 1A and 1B of an insulating substrate. On the thin steps 21, surface-directional plating parts 42 are laminated on the thin steps 21 to protrude from both ends of penetration-directional plating parts 41 deposited on the inner wall of the through hole 3 along the insulating substrate 1. Consequently, the conductor patterns 2 and the plated through holes 3 are interconnected having contact surfaces extending along the conductor patterns 2 and in a direction crossing it. 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SOLUTION: Thin steps 21 are formed at peripheral edges of through holes of conductor patterns 2 formed on both top and reverse surfaces 1A and 1B of an insulating substrate. On the thin steps 21, surface-directional plating parts 42 are laminated on the thin steps 21 to protrude from both ends of penetration-directional plating parts 41 deposited on the inner wall of the through hole 3 along the insulating substrate 1. Consequently, the conductor patterns 2 and the plated through holes 3 are interconnected having contact surfaces extending along the conductor patterns 2 and in a direction crossing it. 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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
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