PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a printed wiring board which reconciles both a thin-line and high-density conductor pattern and connection reliability, and to provide its manufacturing method. SOLUTION: Thin steps 21 are formed at peripheral edges of through holes of conductor patterns 2 formed on...

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Bibliographische Detailangaben
Hauptverfasser: SUGIYAMA TEI, IMAMURA EIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a printed wiring board which reconciles both a thin-line and high-density conductor pattern and connection reliability, and to provide its manufacturing method. SOLUTION: Thin steps 21 are formed at peripheral edges of through holes of conductor patterns 2 formed on both top and reverse surfaces 1A and 1B of an insulating substrate. On the thin steps 21, surface-directional plating parts 42 are laminated on the thin steps 21 to protrude from both ends of penetration-directional plating parts 41 deposited on the inner wall of the through hole 3 along the insulating substrate 1. Consequently, the conductor patterns 2 and the plated through holes 3 are interconnected having contact surfaces extending along the conductor patterns 2 and in a direction crossing it. COPYRIGHT: (C)2006,JPO&NCIPI