FILM SUBSTRATE WITH ELEMENT

FILM SUBSTRATE WITH ELEMENT

PROBLEM TO BE SOLVED: To suppress a film substrate with elements from being bent so that element misalignment can be avoided. SOLUTION: This film substrate with elements 22 is fixed at a holder 10 with a step 11. This film 22 is positioned along the step 11 through a slit 24a provided at a part corr...

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Hauptverfasser: TANAKA SADAHIKO, TAKIZAWA KEITARO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TANAKA SADAHIKO
TAKIZAWA KEITARO
description PROBLEM TO BE SOLVED: To suppress a film substrate with elements from being bent so that element misalignment can be avoided. SOLUTION: This film substrate with elements 22 is fixed at a holder 10 with a step 11. This film 22 is positioned along the step 11 through a slit 24a provided at a part corresponding to the step 11, to select the rigidity of the part corresponding to the step 11 lower than that of the other part. COPYRIGHT: (C)2006,JPO&NCIPI
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This film 22 is positioned along the step 11 through a slit 24a provided at a part corresponding to the step 11, to select the rigidity of the part corresponding to the step 11 lower than that of the other part. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title FILM SUBSTRATE WITH ELEMENT
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