FILM SUBSTRATE WITH ELEMENT

PROBLEM TO BE SOLVED: To suppress a film substrate with elements from being bent so that element misalignment can be avoided. SOLUTION: This film substrate with elements 22 is fixed at a holder 10 with a step 11. This film 22 is positioned along the step 11 through a slit 24a provided at a part corr...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA SADAHIKO, TAKIZAWA KEITARO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress a film substrate with elements from being bent so that element misalignment can be avoided. SOLUTION: This film substrate with elements 22 is fixed at a holder 10 with a step 11. This film 22 is positioned along the step 11 through a slit 24a provided at a part corresponding to the step 11, to select the rigidity of the part corresponding to the step 11 lower than that of the other part. COPYRIGHT: (C)2006,JPO&NCIPI