CHIP CAPACITOR MOUNTING STRUCTURE AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To reduce a power supply and ground noise caused by high performance and high frequency of a semiconductor device with a BGA package mounted on a printed wiring board, and to reduce a chip capacitor mounting area used for noise reduction. SOLUTION: As a mounting structure for c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUMOTO TAKASHI, KAWADA ATSUMI, TAKAHIRA MITSURU, MIZOE YUKIO, TSUNODA ATSUSHI, KAMISAKA AKIRA, ONO TAKAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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