FACE-MOUNTING OPTICAL TRANSMISSION DEVICE AND ELECTRONIC APPARATUS MOUNTING THE SAME

PROBLEM TO BE SOLVED: To provide a face-mounting optical transmission device capable of making an outer shape as small as possible in size, and an electronic apparatus mounting the face-mounting optical transmission device. SOLUTION: A PD chip 2 and an IC chip 3 are mounted on a substrate 4, and an...

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Bibliographische Detailangaben
1. Verfasser:	KUMAGAI YOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a face-mounting optical transmission device capable of making an outer shape as small as possible in size, and an electronic apparatus mounting the face-mounting optical transmission device. SOLUTION: A PD chip 2 and an IC chip 3 are mounted on a substrate 4, and an LED chip 1 is mounted on the PD chip 2, thereby making a transfer molding with a mold resin 6. Opposing to the LED chip 1 and the PD chip 2 mounted so as to overlap each other, a light emitting and light receiving lens 7 which transmits a light emitting signal from the LED chip 1 and a light receiving signal to the PD chip 2 is formed with the mold resin 6. COPYRIGHT: (C)2006,JPO&NCIPI