FILM FORMATION METHOD, FILM, ELECTRONIC COMPONENT, AND ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To provide a film formation method capable of readily and inexpensively forming the film of a predetermined pattern, a film formed by such a film formation method, and to provide an electronic component and electronic equipment, equipped with the film. SOLUTION: The film format...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAGAWA TAKUYA, SOGO TOMOHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a film formation method capable of readily and inexpensively forming the film of a predetermined pattern, a film formed by such a film formation method, and to provide an electronic component and electronic equipment, equipped with the film. SOLUTION: The film formation method is to form the film 3 of a predetermined pattern on a base 1. Upon forming the film 3, using flying matter 31 flying to the side of a film formation face on which the film 3 on the base 1 is formed, a treatment by a coupling agent is applied to the film formation face. Consequently, a step D is formed at a boundary of a film-forming region 21 and a non-film forming region 22, such that the distance of the surface of the film formation region 21 from the base 1 is smaller than that of the surface of the non-film forming region 22 from the base 1. Thus, the flying matter 31 is collected to the film-forming region 21 by utilizing the step D. COPYRIGHT: (C)2006,JPO&NCIPI