RESIN MOLDED PRODUCT MANUFACTURING METHOD AND CHANGEOVER DEVICE OF HEATING MEDIUM AND RESIN MATERIAL AT TIME OF SECONDARY MOLDING

PROBLEM TO BE SOLVED: To well perform molding even if a large number of primary molded products different in flow lengths are secondarily molded when a plurality of divided primary molded products are secondarily molded. SOLUTION: A changeover device 30 is arranged between a runner groove 311 connec...

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Bibliographische Detailangaben
Hauptverfasser: NASU HIDEHISA, SAHASHI AKIRA, KUROYANAGI AKIRA, ICHIKAWA MASATO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To well perform molding even if a large number of primary molded products different in flow lengths are secondarily molded when a plurality of divided primary molded products are secondarily molded. SOLUTION: A changeover device 30 is arranged between a runner groove 311 connected to an injection nozzle 40 and a communication groove 312 communicating with a passage on a mold side so as to perform changeover to one of three passages. A first position is a position where a second passage (air connection passage 372) is allowed to communicate with the communication groove 312 to measure the temperature of hot air by a thermocouple 38. A second position is a position where the runner groove 311 and the communication groove 312 are opened by a second passage (injection passage 371) to be allowed to communicate with each other to inject a resin material in the mold. A third position is a position where the injection passage 371 is cut off from the communication groove 312 and a third passage (runner communication passage 374) is allowed to communicate with the runner groove 311 to weld the resin material in the injection passage 371 and the resin material in the runner groove 311. COPYRIGHT: (C)2006,JPO&NCIPI