CUTTING-OFF BLADE

PROBLEM TO BE SOLVED: To provide a cutting-off blade which has an improved grinding performance by preventing the adhesion of chips. SOLUTION: The cutting-off blade 1 has an abrasive grain layer 4 formed on the outer peripheral portion of a thin disk-like base plate 2 with abrasive grains 3 composed...

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Bibliographische Detailangaben
Hauptverfasser:	MOROFUJI TOMOSUKE, KUMAMOTO KENICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	GRINDING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cutting-off blade which has an improved grinding performance by preventing the adhesion of chips. SOLUTION: The cutting-off blade 1 has an abrasive grain layer 4 formed on the outer peripheral portion of a thin disk-like base plate 2 with abrasive grains 3 composed of diamond, etc. A mounting bore 5 for fixing a rotary spindle is provided at the central portion of the base plate 2. The base plate 2 is a hard and brittle base plate formed by the powder metallurgy method. Solid lubricants, such as WS2and MoS2, are added to the base plate 2. It is preferable that 5 to 15 vol.% of the solid lubricants with respect to the base plate are added. Further, it is preferable that the grain size of the solid lubricants is within the range from 1 to 50 μm. COPYRIGHT: (C)2006,JPO&NCIPI