MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM

PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrat...

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1. Verfasser: SCHARNWEBER RALF
Format: Patent
Sprache:eng
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