MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM

PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrat...

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1. Verfasser:	SCHARNWEBER RALF
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrate covered with a photosensitive layer, first exposure is performed in a first projection system (17) according to an exposure parameter of a first group, and second exposure is performed in a second projection system (18) spatially separated from the first projection system (17). These projection systems are integrated with a common projection aligner (1). For example, the first exposure is performed using an amplitude mask (6), and the second exposure is performed using a phase mask (9). The first exposure and the second exposure are performed in parallel, by using a number of projection systems, thereby achieving multiple exposures which save time. COPYRIGHT: (C)2005,JPO&NCIPI