ELECTRICAL CONNECTION BOX

PROBLEM TO BE SOLVED: To improve heat dissipation efficiency with a simple structure. SOLUTION: A heatsink 35 is fixed to a substrate 30, and a heating part SSR40 mounted on the substrate 30 is brought into contact with the heatsink 35. While a projection 37 is formed in a back plate 36A of the heat...

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1. Verfasser: HARADA CHO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve heat dissipation efficiency with a simple structure. SOLUTION: A heatsink 35 is fixed to a substrate 30, and a heating part SSR40 mounted on the substrate 30 is brought into contact with the heatsink 35. While a projection 37 is formed in a back plate 36A of the heatsink 35, the aperture of a window hole 24 is arranged at the cover 20 of a box 12. The heatsink 35 is sandwiched by packings 45, and fixed to the inner surface side of the cover 20 via the window hole 24 of the injection 37 with screws 25. The projection 37 of the heat sink 35 projects outside through the window hole 24, so that the packings 45 carries out the sealing between the window hole 24 and the projection 37. Since it has such a structure that the projection 37 which is a part of the heatsink 35 may come into contact with the open air directly, the heat generation of the heating part SSR40 can be diffused well to the open air, that is, the heat can be dissipated efficiently. Moreover, since it has such a simple structure that severe accuracy may not be required for its manufacturing and administration, the manufacturing cost can also be controlled at a low cost. COPYRIGHT: (C)2005,JPO&NCIPI