WAFER ROTATING MECHANISM AND SEMICONDUCTOR MANUFACTURING DEVICE COMPRISING THE WAFER ROTATING MECHANISM

PROBLEM TO BE SOLVED: To introduce a wafer rotating mechanism to a semiconductor manufacturing device of a hot wall type without using a magnetic seal. SOLUTION: A rotating shaft 2 is made to move in procession in such a way that the rotating shaft 2 of a wafer susceptor 1 is inserted so that it can move in a vertical direction and incline simultaneously at a crowning portion of a holding base 9 fixed on the inner wall of a reaction chamber, in which a rotating shaft bearing 4 having a supporting projection 4a at a center is arranged so that it can contact with the lower end of the rotating shaft, and a power transmitting surface 5a is formed at the lower portion simultaneously, in which a rotor 6 having the furthest end 6a is arranged so that it can rise and rotate at the outside of the crowning portion in a radial direction from the center of rotation beneath the power transmitting surface, the power transmitting surface 5a is pushed outward by raising the rotor 6, and the furthest end 6a is rotated around a rotation center axis line L1 by rotating the rotor 6 in such a state that the rotating shaft 4 is pushed outward by contacting the supporting projection 4a of the rotating shaft bearing to the lower end of the rotating shaft 2. COPYRIGHT: (C)2005,JPO&NCIPI