RESIST PEELING DEVICE, RESIST PEELING METHOD USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an inexpensive and environment-friendly resist peeling device which does not use plasma causing damage during a resist peeling process in manufacturing a semiconductor device and a liquid crystal panel. SOLUTION: The resist peeling device includes a wafer support 102...

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Bibliographische Detailangaben

1. Verfasser:	OGURA TAKEISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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