RESIST PEELING DEVICE, RESIST PEELING METHOD USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an inexpensive and environment-friendly resist peeling device which does not use plasma causing damage during a resist peeling process in manufacturing a semiconductor device and a liquid crystal panel. SOLUTION: The resist peeling device includes a wafer support 102, a valve 104 provided on an exhaust pipe, a waste liquid pipe 105, a steam generator 107, a steam jet nozzle 108, a valve 109 provided on a gas pipe, a vacuum pump 110, and a nozzle 111 for rinsing. A wafer 101 is placed in a container in the device, and steam is jetted and filled into the container from the nozzle 108 to raise the pressure in the container to liquefy the steam for penetrating the steam into the wafer 101. Thereafter, the pressure is reduced in a sealed state to cause part of the liquefied steam to vaporize again, causing a crack on a resist to have the resist peeled. COPYRIGHT: (C)2005,JPO&NCIPI