PLATING METHOD FOR ELECTRONIC COMPONENTS AND MEMBER FOR MASK USED FOR THE SAME

PROBLEM TO BE SOLVED: To provide a plating method for electronic components having excellent packaging strength and component destruction strength and a member for a mask used for the same relating to a plating method for electronic components used for portable equipment, such as personal computers,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANO KENZO, SATO HIROSHI, NARISAWA YUKI, MORI KANEO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!