PLATING METHOD FOR ELECTRONIC COMPONENTS AND MEMBER FOR MASK USED FOR THE SAME

PROBLEM TO BE SOLVED: To provide a plating method for electronic components having excellent packaging strength and component destruction strength and a member for a mask used for the same relating to a plating method for electronic components used for portable equipment, such as personal computers,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YANO KENZO, SATO HIROSHI, NARISAWA YUKI, MORI KANEO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plating method for electronic components having excellent packaging strength and component destruction strength and a member for a mask used for the same relating to a plating method for electronic components used for portable equipment, such as personal computers, digital video camera (DVC) equipment, digital still camera (DSC) equipment, mini-disk (MD) equipment, and mobile communication equipment and a member for a mask used for the same. SOLUTION: An internal electrode 11 is formed by inserting a ferrite core 17b into a hole 21 disposed at the member 19 for the mask formed of an elastic body to immerse the core in the plating liquid, and plating a collar part 17a of the ferrite core 17b not in contact with the member 19 for the mask with the member 19 for the mask as a mask by an electroless plating method. COPYRIGHT: (C)2005,JPO&NCIPI