PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a metal bump so that the mounting amount and mounting position of a metal bump can be sufficiently controlled and production of a bridge between electrode pads can be enough suppressed even when the pitch between electro...
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| creator | KATAKI HIDEYUKI |
| description | PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a metal bump so that the mounting amount and mounting position of a metal bump can be sufficiently controlled and production of a bridge between electrode pads can be enough suppressed even when the pitch between electrode pads is narrow. SOLUTION: The photosensitive resin composition is used in a method for forming a metal bump including: a photosensitive resin layer forming step to form a photosensitive resin layer containing a photosensitive resin composition on a wiring board or electronic parts having an electrode pad part; a hardened resist layer forming step to irradiate the photosensitive resin layer with active rays to expose and photo-set the exposed part in a predetermined pattern and to remove a portion out of the exposed part in the photosensitive resin layer to form a hardened resist layer having an aperture connecting to at least a part of the electrode pad part; and a step of filling the aperture with metal. The composition contains (A) a copolymer containing an unsaturated group-containing monomer as a copolymer component, (B) a photo-crosslinking monomer and (C) a photo-initiator. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005250292A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005250292A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005250292A3</originalsourceid><addsrcrecordid>eNrjZHAO8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvpKDj6uSj4uoZ4-LsouPkHgbCvp587SMjRR8Ep1DeAh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRiYGpkaGFkaORoTpQgAoqAsDQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP</title><source>esp@cenet</source><creator>KATAKI HIDEYUKI</creator><creatorcontrib>KATAKI HIDEYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a metal bump so that the mounting amount and mounting position of a metal bump can be sufficiently controlled and production of a bridge between electrode pads can be enough suppressed even when the pitch between electrode pads is narrow. SOLUTION: The photosensitive resin composition is used in a method for forming a metal bump including: a photosensitive resin layer forming step to form a photosensitive resin layer containing a photosensitive resin composition on a wiring board or electronic parts having an electrode pad part; a hardened resist layer forming step to irradiate the photosensitive resin layer with active rays to expose and photo-set the exposed part in a predetermined pattern and to remove a portion out of the exposed part in the photosensitive resin layer to form a hardened resist layer having an aperture connecting to at least a part of the electrode pad part; and a step of filling the aperture with metal. The composition contains (A) a copolymer containing an unsaturated group-containing monomer as a copolymer component, (B) a photo-crosslinking monomer and (C) a photo-initiator. COPYRIGHT: (C)2005,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050915&DB=EPODOC&CC=JP&NR=2005250292A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050915&DB=EPODOC&CC=JP&NR=2005250292A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KATAKI HIDEYUKI</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP</title><description>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a metal bump so that the mounting amount and mounting position of a metal bump can be sufficiently controlled and production of a bridge between electrode pads can be enough suppressed even when the pitch between electrode pads is narrow. SOLUTION: The photosensitive resin composition is used in a method for forming a metal bump including: a photosensitive resin layer forming step to form a photosensitive resin layer containing a photosensitive resin composition on a wiring board or electronic parts having an electrode pad part; a hardened resist layer forming step to irradiate the photosensitive resin layer with active rays to expose and photo-set the exposed part in a predetermined pattern and to remove a portion out of the exposed part in the photosensitive resin layer to form a hardened resist layer having an aperture connecting to at least a part of the electrode pad part; and a step of filling the aperture with metal. The composition contains (A) a copolymer containing an unsaturated group-containing monomer as a copolymer component, (B) a photo-crosslinking monomer and (C) a photo-initiator. COPYRIGHT: (C)2005,JPO&NCIPI</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAO8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvpKDj6uSj4uoZ4-LsouPkHgbCvp587SMjRR8Ep1DeAh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRiYGpkaGFkaORoTpQgAoqAsDQ</recordid><startdate>20050915</startdate><enddate>20050915</enddate><creator>KATAKI HIDEYUKI</creator><scope>EVB</scope></search><sort><creationdate>20050915</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP</title><author>KATAKI HIDEYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005250292A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KATAKI HIDEYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KATAKI HIDEYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP</title><date>2005-09-15</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a metal bump so that the mounting amount and mounting position of a metal bump can be sufficiently controlled and production of a bridge between electrode pads can be enough suppressed even when the pitch between electrode pads is narrow. SOLUTION: The photosensitive resin composition is used in a method for forming a metal bump including: a photosensitive resin layer forming step to form a photosensitive resin layer containing a photosensitive resin composition on a wiring board or electronic parts having an electrode pad part; a hardened resist layer forming step to irradiate the photosensitive resin layer with active rays to expose and photo-set the exposed part in a predetermined pattern and to remove a portion out of the exposed part in the photosensitive resin layer to form a hardened resist layer having an aperture connecting to at least a part of the electrode pad part; and a step of filling the aperture with metal. The composition contains (A) a copolymer containing an unsaturated group-containing monomer as a copolymer component, (B) a photo-crosslinking monomer and (C) a photo-initiator. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP |
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