PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING METAL BUMP

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a metal bump so that the mounting amount and mounting position of a metal bump can be sufficiently controlled and production of a bridge between electrode pads can be enough suppressed even when the pitch between electrode pads is narrow. SOLUTION: The photosensitive resin composition is used in a method for forming a metal bump including: a photosensitive resin layer forming step to form a photosensitive resin layer containing a photosensitive resin composition on a wiring board or electronic parts having an electrode pad part; a hardened resist layer forming step to irradiate the photosensitive resin layer with active rays to expose and photo-set the exposed part in a predetermined pattern and to remove a portion out of the exposed part in the photosensitive resin layer to form a hardened resist layer having an aperture connecting to at least a part of the electrode pad part; and a step of filling the aperture with metal. The composition contains (A) a copolymer containing an unsaturated group-containing monomer as a copolymer component, (B) a photo-crosslinking monomer and (C) a photo-initiator. COPYRIGHT: (C)2005,JPO&NCIPI