POWER FEED MECHANISM FOR ELECTROPLATING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a power feed mechanism for electroplating equipment which does not exert such excessive tension as to entail the degradation of dimensional stability to a film-like conductor, is free of a power feed defect, such as sparking, and does not afford such a flaw as to cause a product defect to the film-like conductor in continuously subjecting a substrate used for a flexible printed circuit board (FPC) to electroplating by a power feed system from the outside of a plating bath. SOLUTION: The electroplating equipment continuously electroplates the film-like conductor by bringing a cathode electrode into contact with the film-like conductor on the outside of the plating equipment while passing the film-like conductor through the plating bath. The equipment comprises constituting the film-like conductor of conductive elastic body and bringing the conductive elastic body into elastic contact with the film-like conductor. COPYRIGHT: (C)2005,JPO&NCIPI