ROTARY DISK SHAPED STORAGE MEDIUM AND WIRING INTEGRATED HEAD SUSPENSION ASSEMBLY

PROBLEM TO BE SOLVED: To prevent the position of a solder ball from being deviated from a center line when a bonding pad and a lead wiring pad are connected by the solder ball and also to prevent a soldering failure from occurring. SOLUTION: In a head suspension assembly where a solder ball 70 is ar...

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Bibliographische Detailangaben
Hauptverfasser:	MURAKI TAKUMA, HASHI NOBUYUKI, TSUCHIYA TATSUMI, UEMATSU YOSHIO, TSUCHIDA HIROYASU, MUROKAWA TAKAAKI, YOSHIDA TATSUSHI, MATSUMOTO YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent the position of a solder ball from being deviated from a center line when a bonding pad and a lead wiring pad are connected by the solder ball and also to prevent a soldering failure from occurring. SOLUTION: In a head suspension assembly where a solder ball 70 is arranged between a lead wiring pad 56 disposed in a flexure 46 and a bonding pad 55 disposed in a slider 52, and the solder ball 70 is melted to connect the lead wiring pad 56 and the bonding pad 55 by solder, in the vicinity of the center line CL of the surface of the lead wiring par 56, a through hole 56a is formed to drop the solder ball 70 from the surface of the pad 56 by gravity and the contact area 56d of the ball 70 is secured at the side of the slider. COPYRIGHT: (C)2005,JPO&NCIPI