THERMOFORMING METHOD AND THERMOFORMING APPARATUS

PROBLEM TO BE SOLVED: To provide a thermoforming method capable uniformly heating the surface layer of a material to be processed at a high speed and capable of effectively and efficiently performing the thermoforming of the surface of the material to be processed, and a thermoforming apparatus. SOL...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIKUCHI KATSUICHI, KURIMOTO SHUNEI, ADACHI HIROSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermoforming method capable uniformly heating the surface layer of a material to be processed at a high speed and capable of effectively and efficiently performing the thermoforming of the surface of the material to be processed, and a thermoforming apparatus. SOLUTION: The thermoforming apparatus for heating and pressing the surface layer of the material M to be processed to thermoform the same has a placing means 50, on which a laminate 20 is placed, constituted so as to arrange heat transfer members 21 and 22 comprising a material having high heat conductivity on the surface side of the material to be processed, a heater 30 equipped with heating members 31 and 32 for heating the heat transfer members in the laminate placed on the placing means to a predetermined temperature, a cooling press 40 for pressing the heated laminate including the heat transfer members to thermoform and cool the same and a moving means 60 for moving the placing means on which the laminate is placed from the heater to the cooling press. COPYRIGHT: (C)2005,JPO&NCIPI