SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor with a large capacity and with no increase in mounting area, and its manufacturing method. SOLUTION: A flat capacitor element 1 comprises a positive electrode lead-out part 4 and an element 3 where a positive electrode oxide f...

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1. Verfasser: KOBASHI MIKIO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor with a large capacity and with no increase in mounting area, and its manufacturing method. SOLUTION: A flat capacitor element 1 comprises a positive electrode lead-out part 4 and an element 3 where a positive electrode oxide film layer which is a dielectric, a solid electrolyte layer containing a conductive polymer, and a negative electrode conductor layer are sequentially laminated on the surface of a metal electrode body. At least two of them are laminated on both front and rear surfaces of metal element terminal components 8a and 8b and positive electrode lead-out terminal components 9a and 9b abutted for connection with the electrodes. A negative electrode is connected using a conductive adhesive, and the positive electrode lead-out is held by the terminal component 9a and 9b and then electrically connected by laser welding. COPYRIGHT: (C)2005,JPO&NCIPI