PRINTED BOARD, ELECTRONIC CIRCUIT SUBSTRATE, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a printed board and an electronic circuit board having electronic components mounted thereon which relaxes stresses caused in the electronic components or connecting points when a bending stress is applied to the printed board. SOLUTION: The electronic circuit board...

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Hauptverfasser:	MATSUNAGA TOSHIHIRO, KAMIGAI YASUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed board and an electronic circuit board having electronic components mounted thereon which relaxes stresses caused in the electronic components or connecting points when a bending stress is applied to the printed board. SOLUTION: The electronic circuit board mounts a semiconductor element 2 on a printed board 1 having a specified wiring pattern not shown. The semiconductor element 2 is electrically connected to the specified region of the wiring pattern with a solder connection part 3. The printed board 1 has recessed trenches 4 opened on the surface having the wiring pattern formed thereon in the vicinity of a wiring pattern region connectable with the semiconductor element 2. COPYRIGHT: (C)2005,JPO&NCIPI