THIN FILM MANUFACTURING DEVICE, THIN FILM MANUFACTURING METHOD, AND METHOD FOR CLEANING THIN FILM MANUFACTURING DEVICE
PROBLEM TO BE SOLVED: To provide a thin film manufacturing device capable of effectively cleaning a film deposition chamber. SOLUTION: A grounding electrode 2, an electrode 3 and a flat face part 6a of a bulkhead of a film deposition chamber of the thin film manufacturing device are insulated from e...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a thin film manufacturing device capable of effectively cleaning a film deposition chamber. SOLUTION: A grounding electrode 2, an electrode 3 and a flat face part 6a of a bulkhead of a film deposition chamber of the thin film manufacturing device are insulated from each other. The grounding electrode 2 is grounded, the flat face part 6a is connected to a high frequency power source 13, and the electrode 3 is connected to the high frequency power source 13 or grounded in a changing manner by an electrode changing switch 15. The electrode 3 can be used not only for the high frequency electrode but also for the grounding electrode. If the electrode is connected to the high frequency electrode 13, film deposition can be performed by the discharge between the electrode and the grounding electrode 2, and if grounding is performed and discharge is performed between the high frequency power source and the flat face part 6a, reaction by-product deposited therebetween can be decomposed. COPYRIGHT: (C)2005,JPO&NCIPI |
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