METHOD FOR CURING THERMOSETTING RESIN

PROBLEM TO BE SOLVED: To provide a method for curing a thermosetting resin capable of suppressing generation of a volatile organic substance (VOC) during curing while maintaining curing properties of a thermosetting resin. SOLUTION: The method for curing a thermosetting resin comprises adding 0.01-1...

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Hauptverfasser:	ICHIKAWA HIDEJI, HAYASHI MASAKI, KOJIMA TATSUIE
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for curing a thermosetting resin capable of suppressing generation of a volatile organic substance (VOC) during curing while maintaining curing properties of a thermosetting resin. SOLUTION: The method for curing a thermosetting resin comprises adding 0.01-10 pts.wt. of an acetoacetic acid amide to 100 pts.wt. of a thermosetting resin and curing the resulting mixture. A thermosetting resin composition is prepared by adding 0.01-10 pts.wt. of an acetoacetic acid amide to 100 pts.wt. of a thermosetting resin. An inhibitor to suppress the generation of a volatile organic substance during curing of a thermosetting resin comprises an acetoacetic acid amide. COPYRIGHT: (C)2005,JPO&NCIPI