IN-SITU ABSOLUTE MEASURING METHOD AND EQUIPMENT FOR THICKNESS OF THIN FILM, REMOVAL RATE OF THIN FILM AND REMOVAL END POINT

PROBLEM TO BE SOLVED: To provide constructive thickness measuring device and method by an in-situ process for determining the thickness of a thin film, an ashing speed and an end point. SOLUTION: There is included a room having a primary visual field port 126 and a secondary visual field port 127. T...

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Bibliographische Detailangaben
Hauptverfasser:	JANOS ALAN, MONTIEN SAUBHAYANA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
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