METHOD OF MANUFACTURING ELECTRONIC COMPONENT

METHOD OF MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic components, having a protective film and an electrode pad, which improves the yield and which can also improve the electrical characteristics. SOLUTION: An IDT 2, the electrode pad 3, and a piezoelectric thin film 5 are formed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TOSE MASATO, KURAHASHI KENTA, HAYASHI MASATAKE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic components, having a protective film and an electrode pad, which improves the yield and which can also improve the electrical characteristics. SOLUTION: An IDT 2, the electrode pad 3, and a piezoelectric thin film 5 are formed on a substrate 1. A resin layer 9 for a mask contains an ethyl cellulose as the main material, and is formed on the electrode pad 3. A protective film 6 is formed on the piezoelectric thin film 5 by sputtering. The resin layer 9 for the mask is removed, thereby removing the protective film 6 formed on the resin layer 9 for the mask. COPYRIGHT: (C)2005,JPO&NCIPI