COPPER FOIL WITH FIBER-REINFORCED RESIN, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a copper foil with a fiber-reinforced resin suitable to form a thin insulation layer excellent in reliability and its manufacturing method. SOLUTION: The manufacturing method of the copper foil with fiber-reinforced resin comprises the steps of forming a resin layer...

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Bibliographische Detailangaben
1. Verfasser:	TERAO TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a copper foil with a fiber-reinforced resin suitable to form a thin insulation layer excellent in reliability and its manufacturing method. SOLUTION: The manufacturing method of the copper foil with fiber-reinforced resin comprises the steps of forming a resin layer on a copper foil and burying a fiber into the resin after making the fiber adhere to this resin layer by an electrostatic force. As the more preferred method, the manufacturing method of the copper foil with fiber-reinforced resin comprises the steps of forming the first resin layer on the copper foil, solidifying the first resin layer after making the fiber adhere by electrostatic force in the condition that this first resin layer is not solidified, and forming the second resin layer on it to make the fiber buried into the resin layer. COPYRIGHT: (C)2005,JPO&NCIPI