MOLD TEMPERATURE ADJUSTING DEVICE, HEAT RECOVERY TANK USED THEREIN AND TEMPERATURE ADJUSTING METHOD

PROBLEM TO BE SOLVED: To provide a mold temperature adjusting device for shortening the cycle time of a process by adjusting the changeover timing of a high temperature medium and a low temperature medium anticipating the delay of the heat transfer of heating and cooling in both of the high temperat...

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Bibliographische Detailangaben
Hauptverfasser: MURANAKA OSAMU, TODA NAOKI, BESSHO MASAHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a mold temperature adjusting device for shortening the cycle time of a process by adjusting the changeover timing of a high temperature medium and a low temperature medium anticipating the delay of the heat transfer of heating and cooling in both of the high temperature medium and the low temperature medium, reducing a temperature change with respect to the set temperature of the high temperature medium and the low temperature medium, reducing energy loss and obtaining a mold temperature optimum to an injection process. SOLUTION: The mold temperature adjusting device is equipped with a high temperature fluid tank 4, a low temperature fluid tank 3, a high temperature fluid supply system 41 and a high temperature fluid return system 42 both of which connect a mold 2 and the high temperature fluid tank 4, a low temperature fluid supply system 31 and a low temperature fluid return system 35 both of which connect the mold 2 and the low temperature fluid tank 3, a high temperature fluid bypass system 43, a low temperature fluid bypass system 40, the heat recovery tank 5 connected to the high temperature fluid tank 4 and a pressure adjusting means. COPYRIGHT: (C)2005,JPO&NCIPI