MANUFACTURING METHOD FOR SEMICONDUCTOR IC DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method for obtaining a QTAT (Quick Turn Around Time) line on a semiconductor IC device manufacturing line, using a high-speed and high-performance (bulk) lot transfer technique. SOLUTION: A transfer system is built using a plurality of transfer units...

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Bibliographische Detailangaben
1. Verfasser:	SHIMIZU MICHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method for obtaining a QTAT (Quick Turn Around Time) line on a semiconductor IC device manufacturing line, using a high-speed and high-performance (bulk) lot transfer technique. SOLUTION: A transfer system is built using a plurality of transfer units of different types (unit characteristics), and service (transfer) corresponding to attributes (production characteristics) of individual transferred lots 18 is provided to carry out high-speed/high-performance transfer. A transferred lot 18 having an attribute of a high demand for early transfer is transferred using a high-speed transfer unit (high-speed transfer section 13), while a lot 18 having a low demand for early transfer is transferred using a bulk transfer unit (high-performance transfer section 14). COPYRIGHT: (C)2005,JPO&NCIPI