CLEANING LIQUID COMPOSITION AND METHOD FOR CLEANING SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a cleaning liquid for a photoresist pattern which can prevent destruction of the photoresist pattern which occurs when a fine photoresist pattern is formed, and to provide a method for cleaning a semiconductor device using the same. SOLUTION: The subject cleaning liq...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WOO SANGGYUN, KIM HYUN WOO, CHO CHINBAI, TEI GENJIN, TEI MEIKO, BUN SAIYU
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cleaning liquid for a photoresist pattern which can prevent destruction of the photoresist pattern which occurs when a fine photoresist pattern is formed, and to provide a method for cleaning a semiconductor device using the same. SOLUTION: The subject cleaning liquid composition comprises a solvent and a surfactant. Its dynamic surface tension measured by the maximum bubble pressure method is not more than 6 bubbles/second-50 dyne/cm. With this cleaning liquid having an excellent dynamic surface tension characteristics, the destruction of the photoresist pattern, which is a problem occurring when the fine photoresist pattern of about not more than 100 nm is formed, can be prevented. Since the cleaning liquid having a surfactant of a high concentration can be prepared with this composition, it can also contribute to reduction of physical distribution. COPYRIGHT: (C)2005,JPO&NCIPI