DIAMOND MACHINING METHOD

DIAMOND MACHINING METHOD

PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining...

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Hauptverfasser: YOSHIKAWA HIROMICHI, FUJIMORI NAOHARU
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator YOSHIKAWA HIROMICHI
FUJIMORI NAOHARU
description PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining precision of 100 μm or less is achieved. SOLUTION: According to the diamond machining method, reciprocation generated by ultrasonic waves at an oscillation frequency of 10 to 100 kHz is transmitted to a machining strip sheet having a thickness of 1,000 μm or less, and a workpiece is machined by collisions of diamond abrasive grains present between the machining sheet and the workpiece. COPYRIGHT: (C)2005,JPO&NCIPI
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005219162A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005219162A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005219162A3</originalsourceid><addsrcrecordid>eNrjZJBw8XT09fdzUfB1dPbw9PP0c1fwdQ3x8HfhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgamRoaWhmZGjsZEKQIAIPkf9g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DIAMOND MACHINING METHOD</title><source>esp@cenet</source><creator>YOSHIKAWA HIROMICHI ; FUJIMORI NAOHARU</creator><creatorcontrib>YOSHIKAWA HIROMICHI ; FUJIMORI NAOHARU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining precision of 100 μm or less is achieved. SOLUTION: According to the diamond machining method, reciprocation generated by ultrasonic waves at an oscillation frequency of 10 to 100 kHz is transmitted to a machining strip sheet having a thickness of 1,000 μm or less, and a workpiece is machined by collisions of diamond abrasive grains present between the machining sheet and the workpiece. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050818&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005219162A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050818&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005219162A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIKAWA HIROMICHI</creatorcontrib><creatorcontrib>FUJIMORI NAOHARU</creatorcontrib><title>DIAMOND MACHINING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining precision of 100 μm or less is achieved. SOLUTION: According to the diamond machining method, reciprocation generated by ultrasonic waves at an oscillation frequency of 10 to 100 kHz is transmitted to a machining strip sheet having a thickness of 1,000 μm or less, and a workpiece is machined by collisions of diamond abrasive grains present between the machining sheet and the workpiece. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBw8XT09fdzUfB1dPbw9PP0c1fwdQ3x8HfhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgamRoaWhmZGjsZEKQIAIPkf9g</recordid><startdate>20050818</startdate><enddate>20050818</enddate><creator>YOSHIKAWA HIROMICHI</creator><creator>FUJIMORI NAOHARU</creator><scope>EVB</scope></search><sort><creationdate>20050818</creationdate><title>DIAMOND MACHINING METHOD</title><author>YOSHIKAWA HIROMICHI ; FUJIMORI NAOHARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005219162A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIKAWA HIROMICHI</creatorcontrib><creatorcontrib>FUJIMORI NAOHARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIKAWA HIROMICHI</au><au>FUJIMORI NAOHARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIAMOND MACHINING METHOD</title><date>2005-08-18</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining precision of 100 μm or less is achieved. SOLUTION: According to the diamond machining method, reciprocation generated by ultrasonic waves at an oscillation frequency of 10 to 100 kHz is transmitted to a machining strip sheet having a thickness of 1,000 μm or less, and a workpiece is machined by collisions of diamond abrasive grains present between the machining sheet and the workpiece. COPYRIGHT: (C)2005,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title DIAMOND MACHINING METHOD
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