DIAMOND MACHINING METHOD

PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIKAWA HIROMICHI, FUJIMORI NAOHARU
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a diamond machining method, and more particularly a diamond ultrasonic machining method, according to which three-dimensional machining of a diamond is enabled, the machining speed is significantly larger than that of grinding by means of a grindstone, and machining precision of 100 μm or less is achieved. SOLUTION: According to the diamond machining method, reciprocation generated by ultrasonic waves at an oscillation frequency of 10 to 100 kHz is transmitted to a machining strip sheet having a thickness of 1,000 μm or less, and a workpiece is machined by collisions of diamond abrasive grains present between the machining sheet and the workpiece. COPYRIGHT: (C)2005,JPO&NCIPI