ELECTRONIC COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide an electronic component mounting device that is superior in production efficiency and highly reliable enough to suck a plurality of electronic components accurately at the same time by a plurality of electronic component suction nozzles, even if the row direction of...

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Bibliographische Detailangaben
1. Verfasser: TAKAMATSU TSUYOSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component mounting device that is superior in production efficiency and highly reliable enough to suck a plurality of electronic components accurately at the same time by a plurality of electronic component suction nozzles, even if the row direction of electronic component supply position is inclined to an X direction. SOLUTION: The electronic component mounting device 10 is provided with a Y-axis driving unit controlling means 12 making the row direction Dn of the electronic component suction nozzle 104 inclinable with respect to the X-axis direction. The control means 12 controls a first Y-axis driving unit 110 and a second Y-axis driving unit 112 to generate a specified Y-axis positional difference between the Y-axis position of an electronic component suction nozzle 104 to be positioned by the first Y-axis driving unit 110 and the Y-axis position of an electronic component suction nozzle 14 to be positioned by the second Y-axis driving unit 112. COPYRIGHT: (C)2005,JPO&NCIPI