METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To manufacture a semiconductor device with an excellent yield even when a manufacturing method for the semiconductor device bonding a filmy adhesive member for a die bonding on the rear of a semiconductor wafer before a dicing process. SOLUTION: The manufacturing method for the semiconductor device has: the process in which a filmy protective member is stuck on the surface of the semiconductor wafer, to which an integrated circuit is formed, and the semiconductor wafer is finished thinly by grinding the rear of the wafer, and the process in which the filmy adhesive member for the die bonding is stuck on the rear of the thinly finished wafer; the peeling process in which the wafer, on which the filmy adhesive material are stuck, is sucked and held extensively over the whole surface from the rear side and the protective member is peeled from the surface of the wafer while maintaining the state; and the process in which the wafer, from which the protective member is peeled, is sucked and held extensively over the whole surface from the surface side and the adhesive member is bonded on the rear of the wafer by carrying out a heat treatment while maintaining the state. COPYRIGHT: (C)2005,JPO&NCIPI