MANUFACTURING METHOD OF ANISOTROPIC CONDUCTIVE FILM

PROBLEM TO BE SOLVED: To provide a method of manufacturing an anisotropic conductive film which enables a terminal connection with excellent connection reliability and insulation property even in connecting minute circuits to each other, or connecting a minute part to the minute circuit. SOLUTION: O...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI TATSUMI, YOSHITOME TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing an anisotropic conductive film which enables a terminal connection with excellent connection reliability and insulation property even in connecting minute circuits to each other, or connecting a minute part to the minute circuit. SOLUTION: On the manufacturing method of the anisotropic conductive film, particles 13 are made to be captured in holes of a porous plate 12, on which holes with a diameter smaller than that of conductive particles are distributed with a distance same as the distance of an intended pattern to be distributed, and afterwards, the conductive particles are transferred on a base material. If necessary, a process of shaking off particles other than those captured in the holes of the porous plate is included. COPYRIGHT: (C)2005,JPO&NCIPI