POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL
PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrou...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TSUCHIIE KAZUYO SUZUKI SHOICHIRO ARITA SATORU FUKUI YOICHI |
| description | PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrous metal such as copper or copper alloy contains univalent and/or divalent copper ions and chlorine ions with the Cu/Cl mole ratio being 10-1to 103, and the pH value being 0.5-10. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005205591A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005205591A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005205591A3</originalsourceid><addsrcrecordid>eNrjZLAO8PfxDPbw9HNX8PEMDPV0UXD0c1FACPq6hnj4uyi4-Qcp-Pn76bq5BgX5hwaDhB19eBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGBqZGBqamloaMxUYoAMyIpvg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL</title><source>esp@cenet</source><creator>TSUCHIIE KAZUYO ; SUZUKI SHOICHIRO ; ARITA SATORU ; FUKUI YOICHI</creator><creatorcontrib>TSUCHIIE KAZUYO ; SUZUKI SHOICHIRO ; ARITA SATORU ; FUKUI YOICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrous metal such as copper or copper alloy contains univalent and/or divalent copper ions and chlorine ions with the Cu/Cl mole ratio being 10-1to 103, and the pH value being 0.5-10. COPYRIGHT: (C)2005,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>ADHESIVES ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POLISHING ; TRANSPORTING</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050804&DB=EPODOC&CC=JP&NR=2005205591A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050804&DB=EPODOC&CC=JP&NR=2005205591A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUCHIIE KAZUYO</creatorcontrib><creatorcontrib>SUZUKI SHOICHIRO</creatorcontrib><creatorcontrib>ARITA SATORU</creatorcontrib><creatorcontrib>FUKUI YOICHI</creatorcontrib><title>POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL</title><description>PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrous metal such as copper or copper alloy contains univalent and/or divalent copper ions and chlorine ions with the Cu/Cl mole ratio being 10-1to 103, and the pH value being 0.5-10. COPYRIGHT: (C)2005,JPO&NCIPI</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAO8PfxDPbw9HNX8PEMDPV0UXD0c1FACPq6hnj4uyi4-Qcp-Pn76bq5BgX5hwaDhB19eBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGBqZGBqamloaMxUYoAMyIpvg</recordid><startdate>20050804</startdate><enddate>20050804</enddate><creator>TSUCHIIE KAZUYO</creator><creator>SUZUKI SHOICHIRO</creator><creator>ARITA SATORU</creator><creator>FUKUI YOICHI</creator><scope>EVB</scope></search><sort><creationdate>20050804</creationdate><title>POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL</title><author>TSUCHIIE KAZUYO ; SUZUKI SHOICHIRO ; ARITA SATORU ; FUKUI YOICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005205591A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>DYES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUCHIIE KAZUYO</creatorcontrib><creatorcontrib>SUZUKI SHOICHIRO</creatorcontrib><creatorcontrib>ARITA SATORU</creatorcontrib><creatorcontrib>FUKUI YOICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUCHIIE KAZUYO</au><au>SUZUKI SHOICHIRO</au><au>ARITA SATORU</au><au>FUKUI YOICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL</title><date>2005-08-04</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrous metal such as copper or copper alloy contains univalent and/or divalent copper ions and chlorine ions with the Cu/Cl mole ratio being 10-1to 103, and the pH value being 0.5-10. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2005205591A |
| source | esp@cenet |
| subjects | ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING TRANSPORTING |
| title | POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T02%3A02%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSUCHIIE%20KAZUYO&rft.date=2005-08-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005205591A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |