POLISHING LIQUID AND POLISHING METHOD FOR NON-FERROUS METAL

PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrou...

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Bibliographische Detailangaben
Hauptverfasser:	TSUCHIIE KAZUYO, SUZUKI SHOICHIRO, ARITA SATORU, FUKUI YOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a non-ferrous metal polishing method capable of polishing a substrate of large film thickness at high speed so that the film thickness distribution is uniform. SOLUTION: Polishing liquid to polish the surface of a substrate with a surface thereof formed of non-ferrous metal such as copper or copper alloy contains univalent and/or divalent copper ions and chlorine ions with the Cu/Cl mole ratio being 10-1to 103, and the pH value being 0.5-10. COPYRIGHT: (C)2005,JPO&NCIPI