MANUFACTURING METHOD FOR CERAMIC MULTI-LAYER SUBSTRATE, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To manufacture ceramic multi-layer substrate having cavities with superior dimensional accuracy, without convexly warping the bottom surface of the cavity. SOLUTION: On both surfaces of a previously sintered substrate 12, a plurality of unsintered low temperature sintering ceramic green sheets 13 in each of which an opening 14a for forming cavity is formed are laminated and thermo-compression-bonded to form a laminate. Then constraining green sheets 15 formed of high temperature sintering ceramics which are not sintered at sintering temperatures of the low temperature sintering ceramic green sheets 13 are laminated on both surfaces of the laminate and thermo-compression-bonded. In this state, while pressurizing by the constraining green sheet 15, or without pressurizing, sintering is performed at 800-1,000°C that is the sintering temperature of the low temperature sintering ceramic green sheet 13. After sintering, residues (ceramic fine particle) of the constraining green sheets 15 stuck to both surfaces of a sintered substrate 11 are removed by blasting or buffing, etc. COPYRIGHT: (C)2005,JPO&NCIPI