SEMICONDUCTOR OPTICAL PACKAGE

PROBLEM TO BE SOLVED: To facilitate the lineup of optical axes of a semiconductor optical amplifier with respect to a semiconductor optical package with TO-CAN structure. SOLUTION: There is provided a reflecting-type semiconductor optical amplifier 210 for amplifying a light input to a primary edge...

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Bibliographische Detailangaben
Hauptverfasser: IN JINKOKU, LEE JEONG-SEOK, SHIN HYUNOL, KIM KOJIN, HWANG SEONG-TEAK
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To facilitate the lineup of optical axes of a semiconductor optical amplifier with respect to a semiconductor optical package with TO-CAN structure. SOLUTION: There is provided a reflecting-type semiconductor optical amplifier 210 for amplifying a light input to a primary edge 210a, by providing: a housing 201; a stem 240 mounted in the housing; a sub mount 220 adhered on the stem 240; the primary edge 210a and a secondary edge 210b through which the light is input and output; and an active layer 211 obliquely provided so as to have a predetermined angle to an axis perpendicular to the primary and secondary edges. The semiconductor optical amplifier 210 is adhered to the sub mount 220 so that an optical axis of the light which is input and output through the primary edge 210a and the secondary edge 210b are perpendicular to both ends of the sub mount 220. COPYRIGHT: (C)2005,JPO&NCIPI