PACKAGE FOR HOUSING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a package for housing an electronic component capable of joining a lid firmly to a metal frame and miniaturizing the outer dimension of an insulating base body, which is reliable in airtightness, and is small and highly reliable; and to provide an electronic device. SOLUTION: The package comprises the insulating base body 1 having an electronic component mounting part 1a on the upper surface thereof, a wiring conductor 2 led from the mounting part 1a to the outer surface of the base body 1, a metal layer 4 for brazing which is formed on the outer periphery of the upper surface of the base body 1 to encircle the mounting part 1a, the metal frame 3 whose undersurface is brazed to the metal layer 4, and the lid 5 attached to the upper surface of the metal frame 3 to cover the mounting part 1a. The outer periphery of the metal frame 3 is located further outside than that of the base body 1. COPYRIGHT: (C)2005,JPO&NCIPI