CONNECTING STRUCTURE OF HARD CIRCUIT SUBSTRATE AND FLEXIBLE BOARD, METHOD OF CONNECTING AND CIRCUIT MODULE USING THE SAME
PROBLEM TO BE SOLVED: To provide a connecting structure which can obtain necessary solder connecting strength, and can prevent adjacent connecting terminals from being short-circuited in the connecting structure of a hard circuit substrate having a plurality of connecting terminals and a flexible bo...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a connecting structure which can obtain necessary solder connecting strength, and can prevent adjacent connecting terminals from being short-circuited in the connecting structure of a hard circuit substrate having a plurality of connecting terminals and a flexible board, and to provide a method of connecting. SOLUTION: A flexible board 2 sandwiching a conductive pattern formed at the end of the connecting terminal of the same shape as the connecting terminals by an insulating flexible resin is superposed on a hard circuit substrate 1 having a plurality of the connecting terminals, and solder connected by heat press bonding. In such a structure, a solder resist 8 is provided on the insulating flexible resin on the flexible board, and further solder connected by using solder plating performed by controlling the amount of occlusion gas on one side of the hard circuit substrate and the flexible board or on both electrodes. COPYRIGHT: (C)2005,JPO&NCIPI |
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