ADDITIVE FOR PLATING BATH

PROBLEM TO BE SOLVED: To provide an additive for a plating bath and a plating bath, even when an electronic component such as an semiconductor device is plated with a plating bath comprising hydroxyalkane sulfonic acid, causing no problems such as a phenomenon that insulation between circuits is mad...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI HIROMITSU, KAWAMATA TAIGA, NITO HIROHISA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an additive for a plating bath and a plating bath, even when an electronic component such as an semiconductor device is plated with a plating bath comprising hydroxyalkane sulfonic acid, causing no problems such as a phenomenon that insulation between circuits is made inferior. SOLUTION: To provide an additive for a plating bath composed essentially of hydroxyalkane sulfonic acid, in which the abundance of alkali metal components to hydroxyalkane sulfonic acid is