HEAT INSULATING WALL STRUCTURE

PROBLEM TO BE SOLVED: To provide a heat insulating wall structure which has not only heat insulating properties, soundproof (sound insulation, sound absorption) properties, fireproof properties, fire resistance, and lightweight properties, but also excellent moisture permeability. SOLUTION: The heat...

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Bibliographische Detailangaben
Hauptverfasser: FUKUDA YASUAKI, YOSHIKAWA MORIKAZU, SHIOJI HIROBUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat insulating wall structure which has not only heat insulating properties, soundproof (sound insulation, sound absorption) properties, fireproof properties, fire resistance, and lightweight properties, but also excellent moisture permeability. SOLUTION: The heat insulating wall structure is constructed by employing a heat insulating panel formed of one face plate and foam arranged on the face plate via spacers, and then forming the other surface of a shapeless filler on a side having no face plate. Preferably the face plate is made of a moisture permeable material having a moisture permeable resistance in the range of 1 to 6 m2h mmHg/g. Especially preferably the face plate is molded of a composition which has unexpanded vermiculite compounded in a base material, and a compounding ratio of the unexpanded vermiculite to the entire composition (solid content) is set in the range of 3 to 70 mass%. COPYRIGHT: (C)2005,JPO&NCIPI